Semiconductor Chip

INSCOPE LABS

State-of-the-art laboratory providing one-stop, cutting-edge testing, failure analysis, device validation, and materials characterization for leading global companies across diverse industries, including Broadcom, Singapore Technologies, Rockwell Automation, TĂśV SĂśD, Biotronik, and Pepperl+Fuchs. With rapid turnaround, we enable clients to accelerate innovation, enhance performance, and sustain a competitive edge.

Inscope Labs is a wholly-owned subsidiary of SEMICAPS, a global leader in high resolution infra-red laser scanning microscopes

Our Services Comprehensive Solutions for Technology Partners

Failure Analysis

Failure
Analysis

Comprehensive root cause investigations on ICs, PCBs, mechanical and electrical assemblies. Identifies failures caused by corrosion, cracks delamination, material fatigue, or thermal/mechanical damage.

Xray Analysis

Xray
Analysis

Non-destructive Xray imaging to detect hidden defects like voids, solder joint issues, wire bond problems, and internal misalignments. Supports inspection of components, packages, and full assemblies.

SEM/EDX Analysis

SEM/EDX
Analysis

Scanning Electron Microscopy (SEM) with Energy-Dispersive X-ray Spectroscopy (EDX/EDS) for detailed surface imaging and elemental analysis. Ideal for contamination, failure sites, and material studies

Advanced Laser Emission Analysis

Advanced Laser
Emission Analysis

Pinpoint faults using TIVA, OBIRCH , LADA, EMMI/PEM using laser, LTP, PEM/EMMI and emission techniques Used for current leakage, latch-up, oxide breakdown, and hot-spot diagnostics

Material Characterization

Material
Characterization

EDX, FTIR, XRF, etc. We identify elemental composition, molecular structure, crystallography, and contamination sources

Electrical Analysis

Electrical
Analysis

Failure analysis of electrical circuits using Curve Tracer, oscilloscopes, and diagnostic tools. Identifies opens, shorts, leakage, EOS, and transient failures

PCB/Assembly Analysis

PCB/Assembly
Analysis

Visual, optical, and microscopic inspection of PCBs and electronic assemblies to evaluate solder quality, component placement, pad delamination, and manufacturing defects.

Authenticity & Counterfeit Detection

Authenticity &
Counterfeit

Protect your supply chain with inspection to detect fake or substandard components via imaging, spectroscopy, and package-level inspection

Reliability & Environmental Testing

Reliability &
Environmental

Accelerated life testing including thermal cycling, humidity exposure, burn-in, and bias stress. Evaluates product robustness and lifetime performance under real-world conditions.

Sample Preparation

Sample
Preparation

Precision preparation services including cross-sectioning, polishing, decapsulation, FIB milling, sputter coating to support imaging and structural analysis

Thermal & Mechanical Analysis

Thermal &
Mechanical

Using DSC, TGA, MFI to evaluate thermal transitions,decomposition,cure profiles and outgassing. Mechanical testing like Bondpull/Ball shear, hardness measurements

Reverse Engineering

Reverse
Engineering

Deconstruct and analyze components for benchmarking or competitive studies. Understand layer structure, process techniques, and design features

Industry Our Services are used across a wide range of industries

Semiconductor & Electronics

Semiconductor &
Electronics

We provide comprehensive failure analysis, material characterization, and process validation to support semiconductor fabs, IC designers, and electronics manufacturers in ensuring product integrity and yield optimization

Automotive & Mechanical Systems

Automotive &
Mechanical

Our lab supports automotive OEMs and Tier 1 suppliers with diagnostics for component failure, environmental reliability testing, and material validation to meet safety and performance standards.

Aerospace, Military & Space

Aerospace,
Military & Space

We deliver high-reliability testing and root cause investigations for mission-critical components, helping clients in aerospace and defense meet stringent certification and operational requirements.

Medical Devices & Life Sciences

Medical Devices &
Life Sciences

We assist Medtech developers and manufacturers with contamination analysis, material validation, and reliability testing to ensure compliance with regulatory standards and patient safety

Assembly House

Assembly
House

We investigate electronic assembly failures from solder joint concerns to material delamination and contamination with in-depth insights grounded in industry standards. As an IPC-A-610 certified facility, we bring a strong foundation in workmanship quality to support better outcomes in reliability and performance

Smart Cards & Secure Devices

Smart Cards &
Secure Devices

Our capabilities include in-depth analysis services to ensure functionality and integrity of smart cards and security modules. We specializes in identifying and resolving critical packaging defects such as bonding wire anomalies, bond pad cratering, delamination, and other internal interconnect failures

Display, Imaging & Camera Modules

Display, Imaging
& Camera Modules

We analyze defects and performance issues in LEDs, advanced display panels, camera modules, and optical systems, ensuring image quality, alignment precision, and long-term reliability.

Communications & Laser Technology

Communications &
Laser Technology

We support photonic and RF device development with advanced failure localization, layer imaging, and optical analysis to help ensure performance across high-speed communications systems.

Nanotechnology & Advanced Materials

Nano &
Advanced Materials

We provide structural and elemental analysis at the nanoscale to aid in R&D and production of next-gen materials, composites, and nanodevices.

OEMs & Contract Manufacturers

OEMs & Contract
Manufacturers

We help OEMs and EMS providers troubleshoot production issues, qualify materials, and validate processes to reduce downtime and improve product consistency.

Components Traders & Reliability Providers

Components &
Reliability

Our lab helps validate component authenticity, quality, and long-term reliability to ensure trusted supply chains and dependable field performance.

Universities & Research Institutes

Universities &
Research Institutes

We collaborate with academic institutions on research, prototyping, and publication support through material characterization, advanced imaging, and custom testing services

Commercial Labs & Foundries

Commercial Labs &
Foundries

We extend specialized capabilities to other laboratories and wafer foundries seeking high-resolution imaging, defect localization, or third-party analytical support.

Raw Materials & Metallurgy

Raw Materials &
Metallurgy

We analyze metals, alloys, and raw materials to assess purity, microstructure, and failure mechanisms—supporting quality control and process optimization in materials manufacturing.

Hard Disk & Data Storage Technologies

Hard Disk &
Data Storage

We assist in diagnosing failures in HDD, SSD, and storage modules through detailed surface imaging, contamination analysis, and thermal/electrical reliability testing.

Oil, Gas & Energy

Oil, Gas &
Energy

From corrosion and material fatigue to failure analysis of electronic monitoring devices, we provide insight to energy companies for safe and efficient operations in extreme environments.

Devices/Defects Wide Range of Expertise

Integrated Circuits

Integrated
Circuits

Investigate Semiconductor ICs with failures ranging from EOS, latch-up, die cracks, packaging delamination and metallization defects

Adhesive/Coatings

Adhesive/Coatings

Failure Analysis of structural and electronic adhesives, conformal coatings, paint peeling/ die attach and underfill. We assess bonding strengths, voids, delamination, cure uniformity, poor adhesion, contamination, blistering, corroded surfaces, peeling, outgassing and under curing

Plating

Plating

Analysis of plated surfaces such as Gold, nickel or tin plating layers for peeling, blistering, corrosion and uneven deposition resulting in non-uniformity. Precise measurements using Ion milling/ Focus Ion Beam

Chemicals

Chemicals

Characterize chemicals and residues used in manufacturing process(i.e. fluxes, cleaning agents, conformal coatings) for contamination, instability and material compatibility.

Printed Circuit Boards

Printed
Circuit Boards

Perform layer by layer PCB failure analysis, examining issues like pad lifting, trace burnout, delamination, via defects, ionic contamination from flux residues

Modules

Modules

Failure investigation on assembled electronic modules includes common issues such as poor solder joints, misaligned components, short or open circuits, EOS, Solder flux contamination, BGA voids

Wire Bonding

Wire
Bonding

Analysis of wire bonding in semiconductor packages and modules. Common defects include bond lift, heel break, necking, ball deformation, bond pad cratering, corrosion and intermetallic growth

Battery Analysis

Battery
Analysis

We evaluate lithium-ion and other rechargeable batteries for swelling, electrolyte leakage, corroded charging pins, over discharge, short circuits and capacity degradation

Plastic Parts

Plastic
Parts

Investigate molded or machined plastic parts for cracking, warping, poor adhesion, voids, chemical changes. Support includes FTIR, microscopy, mechanical and thermal analysis

Light Emitting Diodes

Light
Emitting Diodes

Analysis of both discrete and packaged LEDs for issues such as brightness degradation, bond wire failures, lens discoloration and thermal overstress

Springs

Springs

Mechanical and fatigue analysis of metallic springs under repeated stress. Common failures include crack initiation, surface corrosion, plastic deformation and spring back loss

Housings/ Casings

Housings/
Casings

Analyze plastic and metal casings used for electronics, mechanical systems and consumer products. Investigate for cracks, fractures, paint delamination, environmental corrosions

Paper-based Materials

Paper-based
Materials

Analysis of specialty paper used in packaging, labels or insulation. Surface analysis for microstructure study, potential debris contamination and presence of structural breakdown

Sensors

Sensors

Analyze industrial sensors for component alignment, connector wear, wire bonding failures, encapsulation voids, cold solder joints, electrical intermittent issues

Mechanical Components

Mechanical
Components

Conduct failure analysis on mechanical components such as screws, bolts, washers etc. Investigate defects such as thread wear down, stress and fatigue fractures, improper sizing and dimensional deviations causing poor mechanical fitting

Mechanical Relays

Mechanical
Relays

Electromagnetic relay diagnostics including coil burn out, contact wear, arcing and welding. Includes both mechanical actuation and electrical switching behavior

About Us Precision Analysis Excellence

Independent Excellence

Inscope Labs is a state‑of‑the‑art laboratory providing comprehensive, one‑stop solutions in cutting‑edge testing, failure analysis, device validation, and materials characterization. Headquartered in Singapore and serving clients worldwide, we partner with leading organizations across a diverse range of industries.

As a full‑service analytical partner, we offer everything from hourly SEM services to the most advanced optical probing techniques, right through to full virtual lab partnerships with multinational enterprises. Our combination of analytical capabilities and deep scientific expertise enables clients to accelerate innovation, enhance performance, and maintain a decisive competitive edge. A wholly‑owned subsidiary of SEMICAPS — a global leader in high‑resolution infrared laser scanning microscopes — Inscope Labs leverages world‑class technology and know‑how to deliver unmatched quality, insight, and speed.

Since 2000
Years of Service
ISO 9001:2015
Quality Certified
IPC 610-A
Standards Certified
200+
Companies Served

Contact Us

INSCOPE LABS Pte Ltd

11 Ubi Road 1, #07-01,

Singapore 408723

Telephone

+65 6779 3735

Fax

+65 6779 3748

For Brochure and Enquiries

Contact our team for comprehensive analytical solutions

Contact Us